Integrated Camera Lens Suspension

ABSTRACT

A camera lens suspension assembly includes a support member including a support metal base layer, a moving member including a moving metal base layer, bearings and smart memory alloy wires. The support member includes a bearing plate portion, static wire attach structures, and mount regions. A printed circuit on the support metal base layer includes traces extending to each static wire attach structure. The moving member includes a moving plate portion, elongated flexure arms extending from a periphery of the moving plate portion and including mount regions on ends opposite the moving plate portion, and moving wire attach structures. The bearings are between and engage the bearing plate portion of the support member and the moving plate portion of the moving member. Each of the smart memory alloy wires is attached to and extends one of the static wire attach structures and one of the moving wire attach structures.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No.14/951,573, filed Nov. 25, 2015, entitled Integrated Camera LensSuspension which claims the benefit of U.S. Provisional Application No.62/086,595, filed on Dec. 2, 2014, entitled Improvements to OpticalImage Stabilization (OIS) Camera Lens Suspension, and also claims thebenefit of U.S. Provisional Application No. 62/129,562, filed on Mar. 6,2015, entitled Two-Piece Camera Lens Suspension with IntegratedElectrical Leads, all of which are incorporated herein by reference intheir entirety and for all purposes.

FIELD OF THE INVENTION

The invention relates generally to camera lens suspensions such as thoseincorporated into mobile phones.

BACKGROUND

PCT International Application Publication Nos. WO 2014/083318 and WO2013/175197 disclose a camera lens optical image stabilization (OIS)suspension system that has a moving assembly (to which a camera lenselement can be mounted) supported by a flexure element or spring plateon a stationary support assembly. The moving assembly is supported formovement on the support assembly by plural balls. The flexure element,which is formed from metal such as phosphor bronze, has a moving plateand flexures. The flexures extend between the moving plate and thestationary support assembly and function as springs to enable themovement of the moving assembly with respect to the stationary supportassembly. The balls allow the moving assembly to move with littleresistance. The moving assembly and support assembly are coupled byshape memory alloy (SMA) wires extending between the assemblies. Each ofthe SMA wires has one end attached to the support assembly, and anopposite end attached to the moving assembly. The suspension is actuatedby applying electrical drive signals to the SMA wires. Theabove-identified PCT publications are incorporated herein by referencefor all purposes.

There remains a continuing need for improved lens suspensions.Suspension structures of these types that are highly functional,relatively thin or low profile, robust and efficient to manufacturewould be particularly desirable.

SUMMARY

The invention is an improved suspension assembly comprising a supportmember including a support metal base layer formed as single piece ofmetal, a moving member including a moving metal base layer formed as asingle piece of metal, a bearing, and a smart memory alloy wire. Inembodiments, the support member includes a bearing plate portion in thesupport metal base layer and a static wire attach structure in thesupport metal base layer. The moving member includes a moving plateportion in the moving metal base layer, flexure arms in the moving metalbase layer extending from the moving plate portion and coupled to thesupport member, and a moving wire attach structure in the moving metalbase layer. The bearing is between and engages the bearing plate portionof the support member and the moving plate portion of the moving member,to enable movement of the moving member with respect to the supportmember. The smart memory alloy wire is attached to and extends betweenthe static wire attach structure of the support member and the movingwire attach structure of the moving member.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a top isometric view of a suspension in accordance withembodiments of the invention.

FIG. 1B is a top plan view of the suspension shown in FIG. 1A.

FIG. 2A is a top isometric view of the support member of the suspensionshown in FIG. 1A.

FIG. 2B is a bottom plan view of the support member shown in FIG. 2A.

FIG. 3A is a detailed top isometric view of a mount region of thesupport member shown in FIG. 2A.

FIG. 3B is a detailed bottom isometric view of the mount region of thesupport member shown in FIG. 2A.

FIG. 4A is a top isometric view of the moving member of the suspensionshown in FIG. 1A.

FIG. 4B is a bottom plan view of the moving member shown in FIG. 4A.

FIG. 5 is a detailed top isometric view of a flexure arm mount regionand a wire attach of the moving member shown in FIG. 4A.

FIG. 6 is a detailed top isometric view of a flexure arm mounting regionand a wire attach of the moving member shown in FIG. 4A.

FIG. 7 is a detailed top isometric view of a support member mount regionand a flexure arm mount region of the suspension shown in FIG. 1A.

FIG. 8 is a sectional view of a portion of the suspension shown in FIG.1A, showing a ball bearing.

FIGS. 9-15 are annotated illustrations of embodiments of the suspension.

FIG. 16 is an annotated illustration of a support member in accordancewith embodiments of the invention.

FIG. 17 is an annotated illustration of a moving member in accordancewith embodiments of the invention.

DESCRIPTION OF THE INVENTION

FIGS. 1A and 1B illustrate a suspension assembly 10 in accordance withembodiments of the invention. As shown, the suspension assembly 10includes a flexible printed circuit (FPC) or support member 12 and aspring crimp circuit or moving member 14 that is coupled to the supportmember. Smart memory alloy (SMA) wires 15 extend between the supportmember 12 and the moving member 14, and can be electrically actuated tomove and control the position of the moving member with respect to thesupport member. In embodiments, the suspension assembly 10 is a cameralens optical image stabilization (OIS) device that can be incorporated,for example, into mobile phones, tablets, laptop computers.

FIGS. 2A, 2B, 3A and 3B illustrate the support member 12 in greaterdetail. As shown, the support member 12 includes a base layer 16 and aplurality of conductive traces 18 such as traces 18 a-18 d in aconductor layer on the base layer. A layer of dielectric 20 is locatedbetween the conductive traces 18 and the base layer 16 to electricallyinsulate the traces from the base layer, which can be metal such asstainless steel. A plurality of wire attach structures such as crimps 24(i.e., static crimps; four are shown in the illustrated embodiment) arelocated on the base layer 16. In the illustrated embodiment the crimps24 are organized as two pairs of adjacent structures that are integrallyformed on a ledge 25 in the base layer 16 at a level spaced (e.g., in az-direction) from a major planar surface portion 26 of the base layer.Other embodiments (not shown) include other wire attach structures(e.g., solder pads) and/or wire attach structures that are organized inother arrangements (e.g., singly rather than in pairs). In embodiments,bearing-retaining recesses 28 are formed in the portion 26 of base layer16. Bearings (shown in FIG. 8) in the recesses 28 can engage the movingmember 14 and movably support the moving member with respect to thesupport member 12. Traces 18 include terminals 30 and contact pads 32 inthe conductor layer on the base layer 16. Each of the traces 18 couplesa terminal 30 to a contact pad 32. For example, contact pads 32 a and 32b are at a first mount region 33 of the support member 12, and traces 18a and 18 b couple terminals 30 a and 30 b to pads 32 a and 32 b,respectively. Contact pads 32 at a second mount region 35 are similarlycoupled to terminal 30 by traces 18. A contact pad 32 is located at eachof the crimps 24 in the illustrated embodiment, and each of the contactpads is coupled by a separate trace to a separate terminal 30 (e.g.,trace 18 d couples terminal 30 d to pad 32 d). The portion of the baselayer 16 on which the terminals 30 are located is formed out of theplane of the major surface portion 26 (e.g., perpendicular to the planeof the major surface portion in the illustrated embodiment). In theillustrated embodiment, the crimps 24 are unitary with and formed fromthe same piece of material of the base layer 16 as the surface portion26.

FIGS. 3A and 3B illustrate in greater detail embodiments of the mountregion 33 of the support member 12. As shown, the mount region 33includes first and second mounting pads 40 and 42. Mounting pad 42includes an island or pad portion 44 in the base layer 16 that iselectrically isolated from other portions of the base layer. The islandpad portion 44 can be supported in part from adjacent portions of thebase layer 16 by areas of dielectric 20 that extend between the islandpad portion and adjacent portions of the base layer. Trace 18 a andcontact pad 32 a extend to the island pad portion 44, and in embodimentsare electrically connected to the island pad portion 44 by an electricalconnection such as a plated or other via 46 that extends through thedielectric 20 at the mounting pad 42. Other embodiments include otherelectrical connections in place of or in addition to via 46, such as,for example, conductive adhesive that extends between the contact pad 32a and island pad portion 44 over the edges of the dielectric 20.Mounting pad 40 is adjacent to mounting pad 42, and includes a padportion 48 in the base layer 16 (that in embodiments functions as anelectrical ground or common structure), and an electrical connectionsuch as via 50 that connects the contact pad 32 b to the pad portion 48.The mount region 35 can be similar to mount region 33.

FIGS. 4A, 4B, 5, 6 and 7 illustrate embodiments of the moving member 14in greater detail. As shown, the moving member 14 includes a plate 60and spring or flexure arms 62 extending from the plate 60. In theillustrated embodiments, the plate 60 is a rectangular member, and eachflexure arm 62 is an elongated member having first and second portions64 and 66 that extend along two sides of the periphery of the plate. Inthe illustrated embodiment, the plate 60 and flexure arms 62 are formedin the same piece of material of a spring metal base layer 68 such asstainless steel. Moving member 14 also includes SMA wire attachstructures such as crimps 70 (moving crimps; four are shown in theillustrated embodiment, organized in pairs). In the illustratedembodiment, the crimps 70 are unitary with and formed from the samepiece of spring metal base layer 68 as the plate 60 (i.e., on ends ofarms 72 extending from the plate). Moving member 14 is configureddifferently in other embodiments. For example, in other embodiments (notshown) the flexure arms 62 can be shaped differently, be different innumber, organized differently, and/or can extend from other locations onthe plate 60. In still other embodiments (not shown), the crimps 70 canbe formed as separate structures that are attached to the plate 60(i.e., not unitary with the plate). Other embodiments (not shown)include other types of wire attach structures (e.g., solder pads) and/orwire attach structures that are organized in other arrangements (e.g.,singly rather than in pairs).

The end portions of the flexure arms 62 have mount regions 74 that areconfigured to be mounted to the mount regions 33 and 35 of the supportmember 12. Conductive traces 76 on the base layer 68 extend on theflexure arms 62 from the mount regions 74. In embodiments, the traces 76also extend on the base layer 68 over portions of the plate 60. In theillustrated embodiment, the traces 76 also extend to contact pads 77 onthe arms 72 on the plate 60. In the illustrated embodiment, the contactpads 77 are on platforms extending out of the major planar surface ofthe plate 60. The contact pads are at other locations (e.g., on theplate 60) in other embodiments (not shown). A layer of dielectric 78 islocated between the conductive traces 76 and the base layer 68 toelectrically insulate the traces from the base layer. Mount regions 74include first and second mounting pads 80 and 82. Each mounting pad 82includes an island or pad portion 84 in the base layer 68 that iselectrically isolated from other portions of the base layer. Each trace76 extends from the mounting pad 82, over (and electrically insulatedfrom) the mounting pad 80. In the illustrated embodiment, the portionsof traces 76 extending between the mounting pads 80 and 82 are enlargedover the portions of the traces on the flexure arms 62 to providesupport for the island pad portions 84 in the base layer 68. The traces76 extend to the island pad portions 84, and in embodiments areelectrically connected to the island pad portions by electricalconnections such as a plated or other via 86 that extends through thedielectric 78 at the mounting pad 82. Other embodiments include otherelectrical connections in place of or in addition to vias 86, such asconductive adhesive that extends between the trace 76 and island padportion 84 over the edges of the dielectric 78. Mounting pad 80 includesa pad portion 90 in the base layer 68 that is electrically isolated fromthe trace 76 by the dielectric 78. In the illustrated embodiments, theportions of the traces 76 over the mounting pads 80 and 82 are circularand open in the center, but take other forms in other embodiments (notshown).

As perhaps best shown in FIGS. 1A and 7, the mount regions 74 of themoving member flexure arms 62 are mechanically attached to the mountregions 33 and 35 of the support member 12. The traces 76 on the flexurearms 62 are electrically connected to the associated traces 18 on thesupport member 12. In embodiments, the mechanical connections are madeby welds between the pad portions 84 and 90 in the base layer 68 of themoving member 14 and the corresponding pad portions 44 and 48 in thebase layer 16 of the support member 12. The welds can, for example, bemade through the openings in the traces 76 at the pad portions 84 and90. The welds also enable electrical connections between the padportions 84 and 90 of the moving member 14 and the corresponding padportions 44 and 48 of the support member 12. By these electricalconnections, the metal base layer 68 of the moving member 14, andthereby the moving crimps 70, are electrically connected in common to anassociated trace 18 (i.e., such as 18 b through via 50). Similarly, eachflexure arm trace 76 is electrically connected to an associated trace 18(i.e., such as 18 a through via 46). Other embodiments of the invention(not shown) have other structures for mechanically mounting the flexurearms 62 to the support member 12, and/or for electrically connecting thetraces 76 on the flexure arms to the associated traces 18 on the supportmember. In the illustrated embodiment, conductive metal regions 94 arelocated directly on the metal base layer 68 of the moving member 14 atthe crimps 70 (i.e, there is no dielectric or other insulating materialbetween the conductive metal regions and the metal base layer) toenhance the electrical connections between the metal base layer and theSMA wires 15 engaged by the crimps.

As described in greater detail below, the support member 12 and movingmember 14 can be formed from additive and/or subtractive processes. Baselayers 16 and/or 68 are stainless steel in embodiments. In otherembodiments the base layers 16 and/or 68 are other metals or materialssuch as phosphor-bronze. Traces 18 and 76, terminals 30 and contact pads32 can be formed from copper, copper alloys or other conductors.Polyimide or other insulating materials can be used as the dielectric 20and 78. Other embodiments of the support member 12 and/or moving member14 (not shown) have more or fewer traces 18 and 76, and the traces canbe arranged in different layouts. Structures other than crimps 24, suchas welds, can be used to attach the SMA wires 15 to the base layer 16.Other embodiments of the invention (not shown) have more or fewer crimps24 and 70, and the crimps can be at different locations on the supportmember 12 and moving member 14, respectively.

The embodiment of support member 12 illustrated in FIGS. 2A and 2B hasthree bearing receiving recesses 28. Other embodiments have fewer ormore bearing recesses. FIG. 8 is an illustration of a portion ofsuspension assembly 10 illustrating a bearing 29, in the form of a ball,in one of the recesses 28. A bearing such as 29 is similarly located inthe other recesses 28. As show, the bearing movably engages both thebase layer 16 of the support member 12 and the base layer 68 at theplate 60 of the moving member 14 to enable movement of the moving memberwith respect to the support member. Other embodiments have other bearingstructures and configurations (e.g., including formed dimples extendingfrom the base layer 68 of the plate 60).

FIGS. 9-15 are annotated illustrations of an improved camera lenssuspension assembly in accordance with embodiments of the invention. Thesuspension assembly has two primary components—a base or support member(referred to in FIGS. 9-15 as a static FPC (flexible printed circuit)),and a moving/spring member (referred to in the FIGS. 9-15 as a springcrimp circuit). Both the static FPC (base member) and the spring crimpcircuit (moving member) are integrated lead structures in theillustrated embodiments, in that they have electrical structures such asleads, contact pads and terminals (e.g. in a copper “Cu” or copper alloylayer) formed on the base metal (stainless steel (SST)) in theillustrated embodiments). A layer of insulator (e.g., polyimide or“poly”) separates the portions of the electrical structures that are tobe electrically isolated from the SST (other portions of the Cu layerare connected to or directly on the SST layer). At some locations, theelectrical structures can be electrically connected to the SST layer byelectrical connections (e.g., “vias”) extending from the Cu trace orlead layer to the SST layer through openings in the poly layer. Inembodiments, a lens can be mounted to the spring crimp circuit. In yetother embodiments, an autofocus system supporting the lens can bemounted to the spring crimp circuit.

FIG. 9 illustrates enabling integrated full hard SST (stainless steel)spring and moving crimps—use of poly and copper to take up any springback of full hard SST after crimp for high wire pull strength. Alsoillustrated is enabling solid FPC (flexible printed circuit) SSTlayer—enabling thin 2-piece welded OIS and enabling OIS_COMMON to be FPCSST layer for strong weld connection.

FIG. 10 illustrates integrated spring and crimps—use of poly and copperto take up any spring back of full hard SST after crimp for high wirepull strength. Poly copper will not damage the wire like full hard metalcould during the crimp process.

FIG. 11 illustrates enabling thin 2-piece welded OIS and allowingOIS_Common to be base metal circuit path giving you a solid FPC to weldto.

FIG. 12 illustrates a spring crimp circuit including 120 um full hardSST, 10 um dielectric, 10 um copper and 4 um covercoat. Also illustratedis a static FPC including 102 um annealed SST, 10 um dielectric, 12 umcopper and 4 um covercoat.

FIG. 13 illustrates a top side view including a terminal pad forconnection to auto focus motor and AF-Pad for connection to auto focus(AF) motor (not shown). Also illustrated is a bottom side view includingan FPC that is solid piece (e.g., one piece formed from one piece ofmetal).

FIG. 14 illustrates a lower part (FPC) including OIS_Common copper traceto lower resistance (both feet), a via forming electrical connectionfrom Cu trace to SST (for connection to SST layer of spring crimpcircuit thru feet), and a via forming electrical connection from Cutrace to SST (for connection into AF terminal pad on spring crimpcircuit).

FIG. 15 illustrates an upper part (spring_crimp) including full hard SST(120 um), poly (10 um), CU (10 um) and CL (4 um). Also illustrated is abreak free at assembly weld that enables pre form of spring feet, butkeeps feet in plane for weld locating.

As noted above, the static FPC and spring crimp circuit can be formedfrom overlaying layers of base metal (e.g., a spring metal such as SST),poly and Cu (i.e., the “trace” layer). An insulating covercoat can beapplied over all or portions of the Cu. Corrosion resistant metals suchas gold (Au) and/or nickel (Ni) can be plated or otherwise applied toportions of the trace layer to provide corrosion resistance.Conventional additive deposition and/or subtractive processes such aswet (e.g., chemical) and dry (e.g., plasma) etching, electro plating andelectroless plating and sputtering processes in connection withphotolithography (e.g., use of patterned and/or unpatterned photoresistmasks), as well as mechanical forming methods (e.g., using punches andforms) can be used to manufacture the static FPC and spring crimpcircuit in accordance with embodiments of the invention. Additive andsubtractive processes of these types are, for example, known and used inconnection with the manufacture of disk drive head suspensions, and aredisclosed generally in the following U.S. patents, all of which areincorporated herein by reference for all purposes: Bennin et al. U.S.Pat. No. 8,885,299 entitled Low Resistance Ground Joints for Dual StageActuation Disk Drive Suspensions, Rice et al. U.S. Pat. No. 8,169,746entitled Integrated Lead Suspension with Multiple Trace Configurations,Hentges et al. U.S. Pat. No. 8,144,430 entitled Multi-Layer Ground PlaneStructures for Integrated Lead Suspensions, Hentges et al. U.S. Pat. No.7,929,252 entitled Multi-Layer Ground Plane Structures for IntegratedLead Suspensions, Swanson et al. U.S. Pat. No. 7,388,733 entitled Methodfor Making Noble Metal Conductive Leads for Suspension Assemblies,Peltoma et al. U.S. Pat. No. 7,384,531 entitled Plated Ground Featuresfor Integrated Lead Suspensions.

The static FPC is a one-piece member in the illustrated embodiment, andhas two static crimps (attachment structures) on each of two diagonalcorners of the member (4 static crimps in total). A terminal pad sectionincludes terminal pads in the trace layer that are connected to tracesthat extend over the surface of the member. As shown for example, aseparate trace extends to each of the four static crimps. At each of thestatic crimps is an electrical contact or terminal formed by the traceand poly layers. Formed dimples extending from the upper surface of thestatic FPC member engage the back surface of the spring crimp circuitmember, and function as sliding interface bearings to enable lowfriction movement of the spring crimp circuit member with respect to thestatic FPC. The traces on the static FPC also couple terminal pads toelectrical pad locations on the static FPC that are electrically andmechanically coupled to the spring crimp circuit member (e.g., toprovide electrical signals to an auto focus (AF) assembly and to providea common or ground signal path to the SST layer of the spring crimpcircuit member. Vias couple the respective traces on the static FPC toportions of the SST layer that are connected to the feet.

The spring crimp circuit is a one-piece member in the illustratedembodiments and includes a central member for supporting a lens or autofocus system, and one or more spring arms (two in the illustratedembodiment) extending from the central member. The spring crimp memberhas two moving crimps on each of two diagonal corners of the member (4moving crimps in all). Pedestals or feet in the SST layer (on the endsof the spring arms opposite the central member in the illustratedembodiment) are configured to be welded or otherwise attached tocorresponding locations on the static FPC. Traces on the spring crimpmember are configured to be electrically coupled to traces on the staticFPC (e.g., through the feet) and couple signals to terminal pads such asthe auto focus (AF) terminal pads. In the illustrated embodiment, theSST layer of the spring crimp circuit is used as a signal path to theends of the SMA wires attached to the moving crimps. Electricalconnection between the corresponding terminal pad and trace on thestatic FPC to the SST layer of the spring crimp circuit is provided bythe connection between the feet of the spring arms and the SST layer ofthe static FPC (i.e., the SST layers of the two members are electricallycoupled, and are at a common ground potential in embodiments).

FIG. 16 is an illustration of a support member such as 12 having anintegrated bearing plate, static crimp and FPC in accordance withembodiments of the invention. Material includes hardened CU-BE, PhosBronze, Cu, Ti or SST base. Harder is better but must enable wire crimp.Extensive use of etching to separate electrically. May need to partialetch in crimp bucket regions to enable less cracking and texture for lowresistance crimp. Only having five circuits opens up routing options.Use topside Cu and base layer. FIG. 17 is an illustration of a movingmember such as 14 having an integrated moving crimp and spring inaccordance with embodiments of the invention. Material includes SST,Be—Cu, Cu—Ti, and Phos Bronze. Like the bearing plate, should. No AFleads means all electrically common. Two spring arm design possible.Spring arms and crimp buckets on same layer.

Suspensions in accordance with embodiments of the invention offerimportant advantages. They can for example, be efficiently fabricatedand assembled. They have relatively low profiles or heights.

Although the invention has been described with reference to preferredembodiments, those of skill in the art will recognize that changes canbe made in form and detail without departing from the spirit and scopeof the invention.

1-24. (canceled)
 25. A suspension assembly, comprising: a support metalbase member configured as one-piece; a moving metal base memberconfigured as one-piece, the moving metal base member coupled with thesupport metal base member, the moving metal base member including a padelectrically coupled with a trace, the pad configured on a platformabove a surface of the moving metal base member; and at least one shapememory alloy element attached to and extending between the support metalbase member and the moving metal base member.
 26. The suspensionassembly of claim 25, wherein the moving metal base member coupled withthe support metal base member through one or more flexure arms.
 27. Thesuspension assembly of claim 26, wherein the one or more flexure armsare formed attached to the pad and configured to break free from thepad.
 28. The suspension assembly of claim 27, wherein the pad is formedover a corner of the moving metal base member.
 29. The suspensionassembly of claim 25, wherein the platform is configured to extend outof the surface of the moving metal base member.
 30. The suspensionassembly of claim 27, wherein the trace is configured to be disposed onat least one of the one or more flexure arms.
 31. The suspensionassembly of claim 26, wherein the pad is configured to connect to anauto focus motor.
 32. The suspension assembly of claim 25 at least onebearing extending from the support metal base member.
 33. The suspensionassembly of claim 32, wherein the bearing movably engages the movingmetal base member.
 34. The suspension assembly of claim 32, wherein thebearing includes a formed structure in the support metal base member.35. The suspension assembly of claim 32, wherein the bearing is affixedto the support metal base member and engages the moving metal basemember.
 36. The suspension assembly of claim 25, wherein: the supportmetal base member includes an attach structure; and the at least oneshape memory alloy element is attached to the attach structure of thesupport metal base member.
 37. The suspension assembly of claim 25,wherein: the moving metal base member includes an attach structure; andthe at least one shape memory alloy element is attached to the attachstructure of the moving metal base member.
 38. The suspension assemblyof claim 37, wherein the attach structure of the moving metal basemember includes a crimp.
 39. A camera lens suspension assembly,comprising: a support metal base member configured as one-piece; amoving metal base member configured as one-piece, the moving metal basemember coupled with the support metal base member, the moving metal basemember including a pad electrically coupled with a trace, the padconfigured on a platform above a surface of the moving metal basemember; and at least one shape memory alloy element attached to andextending between the support metal base member and the moving metalbase member.
 40. The camera lens suspension assembly of claim 39,wherein the moving metal base member coupled with the support metal basemember through one or more flexure arms.
 41. The camera lens suspensionassembly of claim 40, wherein the one or more flexure arms are formedattached to the pad and configured to break free from the pad.
 42. Thecamera lens suspension assembly of claim 41, wherein the pad is formedover a corner of the moving metal base member.
 43. The camera lenssuspension assembly of claim 42, wherein the platform is configured toextend out of the surface of the moving metal base member.
 44. Thecamera lens suspension assembly of claim 41, wherein the trace isconfigured to be disposed on at least one of the one or more flexurearms.
 45. The camera lens suspension assembly of claim 40, wherein thepad is configured to connect to an auto focus motor.
 46. The camera lenssuspension assembly of claim 39 at least one bearing extending from thesupport metal base member.
 47. The camera lens suspension assembly ofclaim 46, wherein the at least one bearing movably engages the movingmetal base member.
 48. The camera lens suspension assembly of claim 46,wherein the at least one bearing includes a formed structure in thesupport metal base member.
 49. The suspension assembly of claim 46,wherein the at least one bearing is affixed to the support metal basemember and engages the moving metal base member.
 50. The camera lenssuspension assembly of claim 39, wherein: the support metal base memberincludes an attach structure; and the at least one shape memory alloyelement is attached to the attach structure of the support metal basemember.
 51. The camera lens suspension assembly of claim 39, wherein:the moving metal base member includes an attach structure; and the atleast one shape memory alloy element is attached to the attach structureof the moving metal base member.
 52. The camera lens suspension assemblyof claim 51, wherein the attach structure of the moving metal basemember includes a crimp.